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BGA IC Heating Reballing Stencil Plate For Samsung HUAWEI HTC MTK Android Phone
BGA IC Heating Reballing Stencil Plate For Samsung HUAWEI HTC MTK Android Phone
BGA IC Heating Reballing Stencil Plate For Samsung HUAWEI HTC MTK Android Phone
BGA IC Heating Reballing Stencil Plate For Samsung HUAWEI HTC MTK Android Phone
BGA IC Heating Reballing Stencil Plate For Samsung HUAWEI HTC MTK Android Phone
BGA IC Heating Reballing Stencil Plate For Samsung HUAWEI HTC MTK Android Phone

BGA IC Heating Reballing Stencil Plate For Samsung HUAWEI HTC MTK Android Phone

$ 6.85

Availability: 42 in stock
  • Condition: New
  • Usage: Home DIY
  • MPN: Does not apply
  • Return shipping will be paid by: Buyer
  • Type: Reballing Stencil
  • application: Samsung HUAWEI HTC MTK Android
  • Model Number: BGA Direct Heating Reballing Stenci
  • Brand: Unbranded
  • is_customized: No
  • Restocking Fee: No
  • Item must be returned within: 30 Days
  • Material: Cast Iron
  • All returns accepted: Returns Accepted
  • Refund will be given as: Money Back

    Description

    PHONEFIX 12pcs Full Set BGA Reballing Stencil Template for Samsung Huawei MTK LG Xiaomi, Mobile Phone Rework Repair BGA Reballing Stencils soldering assistant, it is used for professional reballing operation on Samsung Huawei LG MTK Xiaomi Oppo Vivo BGA IC chips.