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Qianli 3D Universal BGA Reballing Stencil for Phone Hard Disk NAND Repair
Qianli 3D Universal BGA Reballing Stencil for Phone Hard Disk NAND Repair
Qianli 3D Universal BGA Reballing Stencil for Phone Hard Disk NAND Repair
Qianli 3D Universal BGA Reballing Stencil for Phone Hard Disk NAND Repair
Qianli 3D Universal BGA Reballing Stencil for Phone Hard Disk NAND Repair
Qianli 3D Universal BGA Reballing Stencil for Phone Hard Disk NAND Repair

Qianli 3D Universal BGA Reballing Stencil for Phone Hard Disk NAND Repair

$ 5.27

Availability: 100 in stock
  • All returns accepted: Returns Accepted
  • Condition: New
  • Refund will be given as: Money back or replacement (buyer's choice)
  • Origin: CN(Origin)
  • Return shipping will be paid by: Buyer
  • Item must be returned within: 30 Days
  • Particle Size: 1-10μm
  • MPN: Does Not Apply
  • Brand: None
  • Model Number: Qianli 3D Stencil
  • Application 1: For iPhone hard disk

    Description

    Qianli 3D Universal BGA Reballing Stencil for Phone Hard Disk NAND Repair
    Qinali 3D Universal BGA Reballing Stencil for iPhone Hard Disk NAND Repair Solder Template Tin Plant Steel Net
    Feature:
    1.3D laser square hole BGA reballing stencil template.
    2.High-speed numerical control technology and high-temperature resistant toughened materials production,round square precise hole posttion,
    3.make steel net more durable,easier to take off the net,more efficient.
    Brand Name: None Origin: CN(Origin) Model Number: Qianli 3D Stencil Particle Size: 1-10μm Application 1: For iPhone hard disk